![]() ![]() NP505-HR offers flexibility in print conditions across a wide range of temperatures and humidity. NP505-HR has been formulated to have reliable post-reflow residues under challenging SIR conditions. Subsequent blog posts will talk about other aspects of teh reflow profile. Kester NP505-HR Solder Paste is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high-reliability applications. A recommended ramp rate would be between 0.75☌/s and 2☌/s. ![]() Heating the paste too much before all the solvents evaporate will cause the viscosity to decrease which will then lead to solder slumping. Another defect you may see from a too fast ramp-up is slumping of the solder paste, which can lead to bridging. It is crucial that this is a slow and controlled ramp-up if the paste is heated up too quickly the flux will boil and start to spatter solder all over the board. The very beginning of the reflow process, during the first few oven zones, focuses on drying out the solvents in the solder paste, getting ready for the activators in the flux to begin removing oxides. For this reason it is important to understand the different stages of a reflow profile and how they can affect the end solder joint. Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For a list of compatible products, visit Kester’s website or contact Kester Technical Support. NP545 is classified as ROL0 under IPC JSTD-004 and ROM0 under IPC JSTD-004B. The paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. SiP & Heterogeneous Integration & Assembly (HIA) paste transfer efficiencies of 0.55 to 0.5AR.The Indium Corporation & Macartney Family Foundation. ![]()
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |